TSL1401CSLF
128 ?1 LINEAR SENSOR ARRAY WITH HOLD
TAOS072E APRIL 2007
12
r
r
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL INFORMATION
The TSL1401CS-LF is available in a solder bump linear array package, ready for surface mount manufacturing
processes.
SOLDER BUMP LINEAR ARRAY
Pin 1 SI
Pin 2 HOLD
Pin 3 CLK
Pin 4 GND
Pin 5 GND
Pin 6 AO
Pin 7 SO
Pin 8 V
DD
8120
8870 + 25
TOP VIEW
SIDE VIEW
Pixel 1
Pixel 128
645 + 55
8 y 145 + 30
Alignment Marker (Pin 8)
1000 + 25
BOTTOM
VIEW
935 + 30
7 y 1000
4 y 170
4 y 415 + 30
127 y 63.5
128 y 55.5
375 + 25
A
B
128 y 63.5
430.4 + 25
DETAIL A
DETAIL B
505 Typ
Lead Free
Pb
300 + 30
400 + 50
Glass Cover Thickness
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ?10 糾 unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The top of the photodiode active area is 415 糾 below the glass that forms the top surface of the package. The index of
refraction of the glass is 1.52.
D. This drawing is subject to change without notice.
Figure 12. TSL1401CSLF Solder Bump Linear Array Package
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